PA Polyamide Hot Melt Adhesive as Hot-Melt Bonding Material

Product Details
Customization: Available
Application: as Hot-Melt Bonding Material
Bonding Function: Polyamide Hot Melt Adhesive
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  • PA Polyamide Hot Melt Adhesive as Hot-Melt Bonding Material
  • PA Polyamide Hot Melt Adhesive as Hot-Melt Bonding Material
  • PA Polyamide Hot Melt Adhesive as Hot-Melt Bonding Material
  • PA Polyamide Hot Melt Adhesive as Hot-Melt Bonding Material
  • PA Polyamide Hot Melt Adhesive as Hot-Melt Bonding Material
  • PA Polyamide Hot Melt Adhesive as Hot-Melt Bonding Material
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Basic Info.

Model NO.
all type
Color
Yellow
Composition
Polyamide Hot-Melt Adhesive
Morphology
Yellow or Light Yellow
Product Name
Polyamide Hot Melt Adhesive
Type
Polyamide
Free Sample
Below 400g, Not Including Express Fee
MOQ
1000kgs
Other Product
Polyamide Resin
Material
Polyimide
Classification
Hot Melt
Promoter Composition
Antioxidant
Characteristic
Polyamide Hot-Melt Adhesive
Main Agent Composition
Polyamide
Transport Package
25kgs /Bag
Specification
industrial grade
Trademark
elite-indus
Origin
Anhui
HS Code
35069110
Production Capacity
300mts/ Month

Product Description

PA hot melt adhesive as hot-melt bonding material.
Polyamide Hot-melt Adhesive



Description:
PA Polyamide Hot Melt Adhesive as Hot-Melt Bonding Material
Polyamide hot-melt adhesive is reacted from dimer acid and diamine.
This hot-melt adhesive has high bonding strength, good suppleness, high temperature resistance and good media resistance.
This polyamide hot-melt adhesive is mainly used in fabric, leather, cable heat shrink sleeve, electrical union seal, adhesive and fix electron component.

It is also be used for adhesive wood, plastic, metal, ceramic and so on.

Performance:
yellowish granula transparent solid. Non-toxic, no stimulation,
can be soluble in most organic solvents, non-soluble in water.


Specification:
Item Specification
ELT-2006 ELT-2007 ELT-2008 ELT-2009 ELT-2010 ELT-2011
Acid value (mgKOH/g) max 5 5 5 6 5 5
Amine value (mgKOH/g) max 5 5 5 6 5 5
Viscosity (mpa.s/190 C degree) 1500-3000 2000-4500 2000-5000 3000-8000 2000-4500 2500-4500
(200 C degree)
Softening point (C degree) 105-115 105-115 100-110 110-130 95-105 105-115
Color (Fe-Co) max 8 8 8 8 8 8
Temperature(C degree) ----- 140-160

Properties: polyamide hot-melt adhesive can be soluble in general organic solvents.
It can be soluble and melt at low temperature, stable at high temperature, has good flexible property.


Potential Applications : polyamide hot-melt adhesive can be used as adhesive for garments, shoes, leather and electric products seal.
It is also be used as hot-melt bonding material.


Package: 25kg/bag,14000-15000kgs /1x20'gp without pallet.
Storage: store in a cool and dry place.
PA Polyamide Hot Melt Adhesive as Hot-Melt Bonding MaterialPA Polyamide Hot Melt Adhesive as Hot-Melt Bonding MaterialPA Polyamide Hot Melt Adhesive as Hot-Melt Bonding Material
PA Polyamide Hot Melt Adhesive as Hot-Melt Bonding Material

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