• Polyamide Hot-Melt Adhesive
  • Polyamide Hot-Melt Adhesive
  • Polyamide Hot-Melt Adhesive
  • Polyamide Hot-Melt Adhesive
  • Polyamide Hot-Melt Adhesive
  • Polyamide Hot-Melt Adhesive

Polyamide Hot-Melt Adhesive

CAS No.: None
Formula: None
EINECS: None
Bonding Function: Polyamide Hot Melt Adhesive
Morphology: Yellow or Light Yellow
Application: as Hot-Melt Bonding Material
Samples:
US$ 5/kg 1 kg(Min.Order)
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Customization:
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Basic Info.

Model NO.
ELT-2006
Material
Polyimide
Classification
Hot Melt
Main Agent Composition
Polyamide
Characteristic
Polyamide Hot-Melt Adhesive
Promoter Composition
Antioxidant
Composition
Polyamide Hot-Melt Adhesive
Color
Yellow
Product Name
Polyamide Hot Melt Adhesive
Other Name
PA Hot Melt Adhesive
Free Sample
Below 400g
MOQ
1000kgs with Pallet
Other Product
Polyamide Resin, Dimer Acid
Transport Package
25kgs /Bag
Specification
industrial grade
Trademark
elite-indus
Origin
Anhui
HS Code
35069110
Production Capacity
300mts/ Month

Product Description

Polyamide Hot-melt Adhesive


Description:
Polyamide Hot-Melt Adhesive
      Polyamide hot-melt adhesive is reacted from dimer acid and diamine. This hot-melt adhesive has high bonding strength,
good suppleness, high temperature resistance and good media resistance. This polyamide hot-melt adhesive is mainly used in fabric,
leather, cable heat shrink sleeve, electrical union seal, adhesive and fix electron component. It is also be used for adhesive wood,
plastic, metal, ceramic and so on.

Performance: yellowish granula transparent solid. Non-toxic, no stimulation, can be soluble in most organic solvents, non-soluble in water.

Specification:
Item Specification
ELT-2006 ELT-2007 ELT-2008 ELT-2009 ELT-2010 ELT-2011
Acid value (mgKOH/g) max 5 5 5 6 5 5
Amine value (mgKOH/g) max 5 5 5 6 5 5
Viscosity (mpa.s/190 C degree) 1500-3000 2000-4500 2000-5000 3000-8000 2000-4500 2500-4500
(200 C degree)
Softening point (C degree) 105-115 105-115 100-110 110-130 95-105 105-115
Color (Fe-Co) max 8 8 8 8 8 8
Temperature(C degree) ----- 140-160

Properties: polyamide hot-melt adhesive can be soluble in general organic solvents.
It can be soluble and melt at low temperature, stable at high temperature, has good flexible property.


Potential Applications : polyamide hot-melt adhesive can be used as adhesive for garments, shoes,
leather and electric products seal.
It is also be used as hot-melt bonding material.


Package: 25kg/bag,14000-15000kgs /1x20'gp without pallet.
Storage: store in a cool and dry place.
Polyamide Hot-Melt Adhesive

 

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Diamond Member Since 2012

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Management System Certification
ISO 9001, ISO 14000
Terms of Payment
LC, T/T, D/P, Western Union
OEM/ODM Availability
Yes